Search for: All records

Abstract Tightly bound electron-hole pairs (excitons) hosted in atomically-thin semiconductors have emerged as prospective elements in optoelectronic devices for ultrafast and secured information transfer. The controlled exciton transport in such excitonic devices requires manipulating potential energy gradient of charge-neutral excitons, while electrical gating or nanoscale straining have shown limited efficiency of exciton transport at room temperature. Here, we report strain gradient induced exciton transport in monolayer tungsten diselenide (WSe₂) across microns at room temperature via steady-state pump-probe measurement. Wrinkle architecture enabled optically-resolvable local strain (2.4%) and energy gradient (49 meV/μm) to WSe₂. We observed strain gradient induced flux of high-energy excitons and emission of funneled, low-energy excitons at the 2.5 μm-away pump point with nearly 45% of relative emission intensity compared to that of excited excitons. Our results strongly support the strain-driven manipulation of exciton funneling in two-dimensional semiconductors at room temperature, opening up future opportunities of 2D straintronic exciton devices. 

Abstract Electromigration in metal interconnects remains a significant challenge in the continued scaling of integrated circuits towards ever‐smaller single‐nanometer nodes. Conventional damascene architectures of barrier/liner layers and conducting metal cause inevitable compromises between device performance and feature dimensions. In contrast to contemporary barrier/liner materials (e.g., Co, Ta, and Ru), an ultrathin passivation layer that can effectively mitigate electromigration is needed. At the ultimate atomically‐thin limit, 2D materials are promising candidates given their exceptional mechanical properties and impermeability. Here, a facile and effective approach is presented to mitigating electromigration in copper (Cu) interconnects via passivation with insulating monolayer 2D hexagonal boron nitride (hBN). The hBN‐passivated Cu interconnects, compared to otherwise identical but bare Cu interconnects, exhibit on average a >20% higher breakdown current density and a >2600% longer lifetime (at a high current density of 5.4 × 10⁷A cm⁻²). Post‐mortem metrology elucidates uniform conformal contact between the hBN‐passivated Cu interface and common failure features due to electromigration.